The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2011

Filed:

Mar. 12, 2008
Applicants:

Yuuichi Takenaka, Chiba, JP;

Hiromitsu Sato, Mobara, JP;

Takanori Sato, Chiba, JP;

Kazumi Akiba, Ooamishirasato, JP;

Yoshihiro Kazuma, Katsuura, JP;

Inventors:

Yuuichi Takenaka, Chiba, JP;

Hiromitsu Sato, Mobara, JP;

Takanori Sato, Chiba, JP;

Kazumi Akiba, Ooamishirasato, JP;

Yoshihiro Kazuma, Katsuura, JP;

Assignees:

Hitachi Displays, Ltd., Chiba-ken, JP;

IPS Alpha Technology, Ltd., Chiba-ken, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a liquid crystal display device which can establish the reliable connection between a printed circuit board and a semiconductor device in spite of the simple constitution thereof. The liquid crystal display device includes a liquid crystal display panel, a printed circuit board arranged close to the liquid crystal display panel, and a semiconductor device arranged between the liquid crystal display panel and the printed circuit board in a striding manner. The semiconductor device includes a flexible printed circuit board and a semiconductor chip. The flexible printed circuit board includes a plurality of first terminals connected to the printed circuit board and a plurality of second terminals connected to a liquid-crystal-display-panel side. The printed circuit board includes a solder resist film, an opening portion formed in the solder resist film, and a terminal portion arranged in the opening portion and consisting of a plurality of terminals connected to the first terminals of the flexible printed circuit board. The terminal portion of the printed circuit board and the first terminals of the semiconductor device are connected with each other by way of an anisotropic conductive film. The anisotropic conductive film overlaps with at least the respective terminals of the terminal portion of the printed circuit board and the solder resist film.


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