The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2011
Filed:
Jan. 30, 2006
Sadamichi Takakusaki, Ota, JP;
Noriaki Sakamoto, Yamada-gun, JP;
Motoichi Nezu, Ora-gun, JP;
Yusuke Igarashi, Isesake, JP;
Sadamichi Takakusaki, Ota, JP;
Noriaki Sakamoto, Yamada-gun, JP;
Motoichi Nezu, Ora-gun, JP;
Yusuke Igarashi, Isesake, JP;
Sanyo Electric Co., Ltd., Moriguchi, JP;
Abstract
In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.