The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2011
Filed:
May. 14, 2007
Masashi Hasegawa, Tokyo, JP;
Masashi Hasegawa, Tokyo, JP;
Abstract
The present invention provides an inexpensive semiconductor chip module enabling sufficient heat dissipation without complicating the manufacture process. A semiconductor chip module according to the present invention includes a plurality of semiconductor chips to be stacked provided at the side face with a connection terminal to be coupled with a circuit pattern formed on the front face, interlayer wiring mutually connecting the connection terminals on the side faces of the respective semiconductor chips by a wiring pattern, and a formation space contributing to heat dissipation, formed between at least some layers of the semiconductor chips, to secure a formation face of the interlayer wiring.