The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2011

Filed:

Sep. 26, 2006
Applicants:

David D. Senk, San Ramon, CA (US);

Joe D. Dickson, Livermore, CA (US);

Inventors:

David D. Senk, San Ramon, CA (US);

Joe D. Dickson, Livermore, CA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods and apparatus for creating independent circuit connections within a through-hole of a substrate are described. According to one aspect of the present invention, a method includes defining a through-hole in a substrate, applying a conductive plating to a holewall of the through-hole, and selectively removing at least a first area of the plating. The through-hole has a height relative to a first axis, and the perimeter of the through-hole at each point along the first axis is approximately the same. Selectively removing the first area of the plating includes defining second areas of the plating. At least one of the plurality of second areas does not span a height of the hole.


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