The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2011

Filed:

Aug. 16, 2007
Applicants:

Maik Liebau, Dresden, DE;

Thomas Betzl, Dresden, DE;

Olaf Storbeck, Dresden, DE;

Georg Duesberg, Booterstown, IE;

Guenther Aichmayr, Dresden, DE;

Inventors:

Maik Liebau, Dresden, DE;

Thomas Betzl, Dresden, DE;

Olaf Storbeck, Dresden, DE;

Georg Duesberg, Booterstown, IE;

Guenther Aichmayr, Dresden, DE;

Assignee:

Qimonda AG, Munich, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of making an integrated circuit comprises providing a substrate and forming a structure on the substrate comprising a first enclosed portion of a carbon material and a second portion of the carbon material, wherein an intersection of the first and second portion of the carbon material has a defined dimension. The method further comprises processing the substrate with a plasma comprising hydrogen in order to etch the second portion of the carbon material, wherein the defined dimension of the intersection of the first and second portion of the carbon material substantially suppresses etching of the first enclosed portion of the carbon material in a self-limiting way.


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