The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2011
Filed:
Oct. 26, 2006
Applicants:
Hiroki Suzuki, Fukushima-ken, JP;
Masato Uehara, Fukushima-ken, JP;
Inventors:
Hiroki Suzuki, Fukushima-ken, JP;
Masato Uehara, Fukushima-ken, JP;
Assignee:
Alps Electric Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 15/16 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); B22F 7/02 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the substrate. A low melting point solder that bonds the component to the electrode. The metal powder contains at least spherical metal powder and flake metal powder. The low melting point solder is infiltrated from the surface of the electrode into the electrode.