The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2011

Filed:

Feb. 13, 2009
Applicants:

Kenjiro Tanaka, Yokohama, JP;

Isamu Takeda, Yokohama, JP;

Atsushi Yoneda, Yokohama, JP;

Eriko Kimotsuki, Yokohama, JP;

Inventors:

Kenjiro Tanaka, Yokohama, JP;

Isamu Takeda, Yokohama, JP;

Atsushi Yoneda, Yokohama, JP;

Eriko Kimotsuki, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 49/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method of a resin container includes continuously supplying a base material resin forming a container body from a main extruder, discharging from a discharge portion provided in a die head a sub-material supplied from a sub-extruder so that the sub-material joins the base material resin, extruding a parison from a slit portion opened on an end side of the die head, and blow-molding the parison, thereby forming a coating layer which covers the whole or a part of the container body by using the sub-material. A thickness reducing portion in which a thickness is continuously reduced is formed in the coating layer while adjusting a resin pressure in a supply path of the sub-material fed from the sub-extruder by performing suck-back control which pulls back the sub-material from the discharge portion at an arbitrary timing when joining the sub-material with the base material resin.


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