The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7935170 B1

PDF
Full Text
Expired
Date of Patent:
May. 03, 2011

Filed:

Nov. 28, 2007
Applicants:

Byung-ho Jun, Seoul, KR;

Jae-woo Joung, Suwon-si, KR;

Joon-rak Choi, Incheon, KR;

Inventors:

Byung-Ho Jun, Seoul, KR;

Jae-Woo Joung, Suwon-si, KR;

Joon-Rak Choi, Incheon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 9/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a method for manufacturing copper-based nanoparticles, in particular, to a method for manufacturing copper-based nanoparticles, wherein the method includes producing CuO nanoparticles by mixing CuO micropowder and alkylamine in a nonpolar solvent and heating the mixture at 60-300° C.; and producing copper-based nanoparticles by mixing a capping molecule and a reducing agent with the CuO nanoparticles and heating the mixture at 60-120° C. According to the present invention, copper-based nanoparticles can be synthesized using CuO, but not requiring any inorganic reducing agent, in a high yield and a high concentration, so that it allows mass production and easy controlling to desired oxidation number of nanoparticles.


Find Patent Forward Citations

Jun, Byung-Ho. (2011). Method for manufacturing copper-based nanoparticles (U.S. Patent No. 7935170). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7935170

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