The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2011

Filed:

Nov. 25, 2008
Applicants:

Min-chieh Chou, Taipei, TW;

Tung-chuan Wu, Hsinchu, TW;

Jen-hui Tsai, Hsinchu, TW;

Hung-yi Lin, Hsinchu, TW;

Inventors:

Min-Chieh Chou, Taipei, TW;

Tung-Chuan Wu, Hsinchu, TW;

Jen-Hui Tsai, Hsinchu, TW;

Hung-Yi Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.


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