The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2011
Filed:
Jan. 12, 2009
Applicant:
Kuo-jung Wu, Taipei Hsien, TW;
Inventor:
Kuo-Jung Wu, Taipei Hsien, TW;
Assignee:
Tong Hsing Electric Industries, Ltd., Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for packaging micro electromechanical systems (MEMS) microphone has steps of providing a base, arranging and mounting multiple microphone component assemblies on the base, providing a frame, mounting the frame on the base, forming multiple microphone units, providing a cover; mounting the microphone units on the cover and forming multiple MEMS microphones. Therefore, the MEMS microphones can be produced once in large quantities to save production time and costs.
Quick Actions:
Wu, Kuo-Jung. (2011). Method for packaging micro electromechanical systems microphone (U.S. Patent No. 7934306). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7934306
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