The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2011
Filed:
Dec. 20, 2005
Applicant:
Andreas Lenniger, Anroechte, DE;
Inventor:
Andreas Lenniger, Anroechte, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor module has a housing () and a metal base plate (). A reliable yet easily producible force-transmitting connection between a semiconductor module and an external heat sink is provided by a mechanical pressure-proof counterpart () which is incorporated into the housing () and forms a firm connection () with a pressure-proof connecting element () on the base plate side. The connection is provided with a passage opening () for fastening the semiconductor module to the heat sink.