The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2011
Filed:
Apr. 28, 2009
Mahalingam Bhaskaran, Lawrenceville, NJ (US);
Pradyumna Kumar Swain, Gaithersburg, MD (US);
Peter Levine, West Windsor, NJ (US);
Norman Goldsmith, East Brunswick, NJ (US);
Mahalingam Bhaskaran, Lawrenceville, NJ (US);
Pradyumna Kumar Swain, Gaithersburg, MD (US);
Peter Levine, West Windsor, NJ (US);
Norman Goldsmith, East Brunswick, NJ (US);
SRI International, Menlo Park, CA (US);
Abstract
A method for fabricating a back-illuminated semiconductor imaging device on a semiconductor-on-insulator substrate, and resulting imaging device is disclosed. The method for manufacturing the imaging device includes the steps of providing a substrate comprising an insulator layer, and an epitaxial layer substantially overlying the insulator layer; fabricating at least one imaging component at least partially overlying and extending into the epitaxial layer; forming a plurality of bond pads substantially overlying the epitaxial layer; fabricating a dielectric layer substantially overlying the epitaxial layer and the at least one imaging component; providing a handle wafer; forming a plurality of conductive trenches in the handle wafer; forming a plurality of conductive bumps on a first surface of the handle wafer substantially underlying the conductive trenches; and bonding the plurality of conductive bumps to the plurality of bond pads.