The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7932012 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 26, 2011

Filed:

Mar. 31, 2004
Applicants:

Hiroshi Komatsu, Ibaraki, JP;

Nagatoshi Fujieda, Ibaraki, JP;

Hajime Nakano, Ibaraki, JP;

Inventors:

Hiroshi Komatsu, Ibaraki, JP;

Nagatoshi Fujieda, Ibaraki, JP;

Hajime Nakano, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat resistant photosensitive resin composition having excellent film properties is provided by constituting a photosensitive resin composition containing (A) a polymer having an acid functional group and/or a substituent derived therefrom, (B) a compound having at least one substituent derived from an amine functional group, (C) a photoreactive compound, and (D) a solvent. Using this composition, a pattern with high resolution can be produced, and thus an electronic part having a high quality can be produced.


Find Patent Forward Citations

Komatsu, Hiroshi. (2011). Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part (U.S. Patent No. 7932012). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7932012

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