Low profile board-to-board connector mating pair with solder barrier

Abstract

An electrical connector comprises a generally rectangular dielectric housing with a mating face and a mounting face. A plurality of terminal support posts extend in a direction from the mounting face towards the mating face and each support post has oppositely facing first and second sidewalls and a connecting surface. A plurality of terminal receiving cavities are spaced along a longitudinal axis of the housing for receiving terminals therein. A plurality of terminals are provided with each including a solder tail portion and a generally U-shaped contact portion. The solder tail portion is positioned along the mounting face and the contact portion includes a first, distal contact leg, a second, proximal contact leg spaced from and generally parallel to the first contact leg and a connecting portion extending between the first and second contact legs. The first contact leg extends along the first sidewall, the second contact leg extending along the second sidewall, and the connecting portion extending along the connecting surface.