The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2011
Filed:
Apr. 23, 2009
Satoshi Takeuchi, Nagoya, JP;
Atusi Sakaida, Nagoya, JP;
Toshihisa Taniguchi, Handa, JP;
Toshikazu Harada, Kariya, JP;
Maki Chiba, Nagoya, JP;
Satoshi Takeuchi, Nagoya, JP;
Atusi Sakaida, Nagoya, JP;
Toshihisa Taniguchi, Handa, JP;
Toshikazu Harada, Kariya, JP;
Maki Chiba, Nagoya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile