The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2011
Filed:
Aug. 05, 2009
Applicants:
Sang Kuk Choi, Daejeon, KR;
Hyun Tak Kim, Daejeon, KR;
Byung Gyu Chae, Daejeon, DE;
Bong Jun Kim, Daejeon, KR;
Inventors:
Sang Kuk Choi, Daejeon, KR;
Hyun Tak Kim, Daejeon, KR;
Byung Gyu Chae, Daejeon, DE;
Bong Jun Kim, Daejeon, KR;
Assignee:
Electronics and Telecommunications Research Institute, Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 21/335 (2006.01);
U.S. Cl.
CPC ...
Abstract
A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.