The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2011
Filed:
Apr. 18, 2008
Applicants:
Akihiro Tamba, Hitachinaka, JP;
Kazuhiro Suzuki, Mito, JP;
Koji Sasaki, Mito, JP;
Shinji Hiramitsu, Kashiwa, JP;
Hirokazu Inoue, Tokai, JP;
Inventors:
Akihiro Tamba, Hitachinaka, JP;
Kazuhiro Suzuki, Mito, JP;
Koji Sasaki, Mito, JP;
Shinji Hiramitsu, Kashiwa, JP;
Hirokazu Inoue, Tokai, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/28 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract
A power semiconductor module having a surface of the power semiconductor chip and an external circuit pattern connected by an aluminum wire, and sealed with an epoxy resin, wherein wire diameter of the aluminum wire is 0.4±0.05 mmφ, and coefficient of linear expansion of the epoxy resin in a rated temperature range of a module is from 15 to 20 ppm/K.