The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7928009 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 19, 2011

Filed:

Apr. 23, 2008
Applicants:

Chih-hung Wu, Longtan Shiang, TW;

Keng-shen Liu, Longtan Shiang, TW;

Chun-ling Chang, Longtan Shiang, TW;

Ying-ru Chen, Longtan Shiang, TW;

Inventors:

Chih-Hung Wu, Longtan Shiang, TW;

Keng-Shen Liu, Longtan Shiang, TW;

Chun-Ling Chang, Longtan Shiang, TW;

Ying-Ru Chen, Longtan Shiang, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for making semiconductor electrodes includes provided a wafer. The wafer includes at least one conductive unit, a plurality of first connective units connected to the conductive unit, a plurality of first metal layers connected to the first connective units and a plurality of second connective units connected to the first metal layers. Photo-resist is provided on the first and second connective units. A second metal layer is provided on each of the first metal layers via using an electroplating device. The wafer is cut through the photo-resist, thus forming semiconductor electrodes.


Find Patent Forward Citations

Wu, Chih-Hung. (2011). Method for making semiconductor electrodes (U.S. Patent No. 7928009). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7928009

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