The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2011

Filed:

Jun. 29, 2007
Applicants:

Kang-jay Hsia, Pleasanton, CA (US);

Calvin K LI, Fremont, CA (US);

Christopher J Petti, Mountain View, CA (US);

Inventors:

Kang-Jay Hsia, Pleasanton, CA (US);

Calvin K Li, Fremont, CA (US);

Christopher J Petti, Mountain View, CA (US);

Assignee:

SanDisk Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method is provided to form densely spaced metal lines. A first set of metal lines is formed by etching a first metal layer. A thin dielectric layer is conformally deposited on the first metal lines. A second metal is deposited on the thin dielectric layer, filling gaps between the first metal lines. The second metal layer is planarized to form second metal lines interposed between the first metal lines, coexposing the thin dielectric layer and the second metal layer at a substantially planar surface. In some embodiments, planarization continues to remove the thin dielectric covering tops of the first metal lines, coexposing the first metal lines and the second metal lines, separated by the thin dielectric layer, at a substantially planar surface.


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