The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7927985 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 19, 2011

Filed:

Nov. 06, 2009
Applicants:

Shinichi Tanaka, Tokyo, JP;

Tatsuya Saito, Tokyo, JP;

Yusuke Yokobayashi, Tokyo, JP;

Inventors:

Shinichi Tanaka, Tokyo, JP;

Tatsuya Saito, Tokyo, JP;

Yusuke Yokobayashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A growth substrate is removed from a semiconductor film, and a surface of the semiconductor film exposed by removing the growth substrate is flattened. The semiconductor film along device division lines are partially etched by dry etching to form grooves in a lattice that form streets, not reaching the metal support in the semiconductor film. The surface of the semiconductor film at the bottom of the grooves is flattened. The semiconductor film along the device division lines at the bottom of the grooves are further etched by wet etching to expose the metal support at the bottom of the grooves to finish the streets.


Find Patent Forward Citations

Tanaka, Shinichi. (2011). Method of manufacturing semiconductor devices (U.S. Patent No. 7927985). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7927985

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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