The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2011
Filed:
Oct. 04, 2005
Hiroshi Haji, Fukuoka, JP;
Kiyoshi Arita, Fukuoka, JP;
Akira Nakagawa, Saga, JP;
Kazuhiro Noda, Fukuoka, JP;
Hiroshi Haji, Fukuoka, JP;
Kiyoshi Arita, Fukuoka, JP;
Akira Nakagawa, Saga, JP;
Kazuhiro Noda, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In a semiconductor wafer including a plurality of imaginary-divided-regions which are partitioned by imaginary-dividing-lines that are respectively arranged in a grid-like arrangement on the semiconductor wafer and a circumferential line that is the outer periphery outline of the semiconductor wafer, a mask is placed so as to expose an entirety of surfaces of the wafer corresponding to respective removal-regions. The removal-regions are regions in approximately triangular form partitioned by the circumferential line of the wafer and the imaginary-dividing-lines. Then, plasma etching is performed on a mask placement-side surface of the wafer, by which the semiconductor wafer is divided into the individual semiconductor devices along dividing lines while portions corresponding to the removal-regions of the wafer are removed.