The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2011

Filed:

May. 08, 2008
Applicant:

Jin Yul Lee, Icheon, KR;

Inventor:

Jin Yul Lee, Icheon, KR;

Assignee:

Hynix Semiconductor Inc., Icheon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8242 (2006.01); H01L 21/4763 (2006.01); H01L 27/108 (2006.01); H01L 29/94 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a method for manufacturing a semiconductor device having a 4F2 transistor. In the method, a gate stack is formed on a semiconductor substrate. A first interlayer dielectric including a contact hole which includes a first region and second regions Spacer layers are formed on both sides of the gate stack and a portion of the second region. Landing plugs are formed on the contact hole, a portion of the semiconductor substrate exposed by a thickness of the spacer layer, and a lateral side of the trench. A second interlayer dielectric is formed to separate the landing plug. The bit line contact plug is connected to a first portion of the landing plug that extends to the lateral side of the trench. The bit line stack is connected to the bit line contact plug. The storage node contact plug is connected to the first portion and a second portion of the landing plug located at a corresponding position in a diagonal direction.


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