The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2011

Filed:

Jan. 31, 2007
Applicants:

Young-gu Lee, Suwon-si, KR;

Sung-kee Kang, Seongnam-si, KR;

Jung-woo Kim, Yongin-si, KR;

Ho-nyeon Lee, Seongnam-si, KR;

Ick-hwan Ko, Seoul, KR;

Young-tea Chun, Suwon-si, KR;

Mi-jeong Song, Suwon-si, KR;

Inventors:

Young-gu Lee, Suwon-si, KR;

Sung-kee Kang, Seongnam-si, KR;

Jung-woo Kim, Yongin-si, KR;

Ho-nyeon Lee, Seongnam-si, KR;

Ick-hwan Ko, Seoul, KR;

Young-tea Chun, Suwon-si, KR;

Mi-jeong Song, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/04 (2006.01); G09G 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A flat panel display device comprises a substrate, an organic light emitting diode formed on the substrate, an inner stack encapsulating the light emitting diode and comprising at least one organic layer and one inorganic layer, and an outer stack deposited to cover the inner stack and comprising at least two polymer layers and an adhesive and bonding layer disposed therebetween to combine the at least two polymer layers and a polymer heat-curing film disposed at an interface of each of the polymer layers and the adhesive and bonding layer and cured by heat treatment. According to the present invention, the flat panel display device and a manufacturing method for the same reliably seals the organic light emitting device and prevents degradation by permeation of external harmful materials, while providing high flexibility and low manufacturing cost.


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