The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2011

Filed:

Apr. 03, 2009
Applicants:

Subhotosh Khan, Midlothian, VA (US);

Halvar Young Loken, Roseland, VA (US);

Inventors:

Subhotosh Khan, Midlothian, VA (US);

Halvar Young Loken, Roseland, VA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/00 (2006.01); C08L 27/06 (2006.01); C08L 27/08 (2006.01); C08L 27/12 (2006.01); C08L 29/04 (2006.01); C08L 33/20 (2006.01); C08L 61/06 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/04 (2006.01); C08L 67/02 (2006.01); C08L 75/04 (2006.01); C08L 77/06 (2006.01); C08L 77/10 (2006.01); C08L 81/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.


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