The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2011
Filed:
Jan. 31, 2007
Yoshikimi Kondo, Tokyo, JP;
Hiroshi Uchida, Tokyo, JP;
Kazuhiro Daikai, Tokyo, JP;
Asahi Kasei Chemicals Corporation, Tokyo, JP;
Abstract
Provided is a microcapsule-based hardener for an epoxy resin, which have a core (C) formed using a hardener (H) for the epoxy resin as a starting material and a shell (S) for covering the core (C) therewith. Since it is characterized in that the hardener (H) for the epoxy resin has an average particle size exceeding 0.3 μm and not greater than 12 μm; a content of a small-particle-size hardener for epoxy resin defined to have a particle size 0.5 time or less of the average particle size of the hardener (H) for the epoxy resin is from 0.1 to 15%; and the shell (S) has, on the surface thereof, a binding group (x) capable of absorbing infrared rays having a wave number of from 1630 to 1680 cm, a binding group (y) capable of absorbing infrared rays having a wave number of from 1680 to 1725 cm, and a binding group (z) capable of absorbing infrared rays having a wave number of from 1730 to 1755 cm, it is excellent in storage stability and at the same time, in reaction rapidity.