The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2011

Filed:

May. 25, 2007
Applicants:

William Scott Radcliffe, Columbus, OH (US);

Michael A. Curran, Westerville, OH (US);

Inventors:

William Scott Radcliffe, Columbus, OH (US);

Michael A. Curran, Westerville, OH (US);

Assignee:

Micro Industries Corporation, Westerville, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); G01K 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A temperature control system and method for a heat sink in an integrated display computer. Temperature sensing and throttling capabilities of ICs are used to prevent a passive heat sink from rising above a maximum temperature. An algorithm for controlling power usage of the ICs limits the maximum heat sink temperature. The maximum temperature is adjustable with an option in the BIOS. The heat sink temperature is controlled by throttling down the ICs when the temperature rises. An ACPI/OSPM passive cooling mechanism for the CPU defines a thermal feedback equation that operates once a thermal trip point is reached. The higher the actual temperature is above the trip point, the faster the CPU throttles down. Likewise, the CPU throttles up as the actual temperature drops below the trip point. The reported CPU temperature is adjusted higher or lower depending on how close the actual temperature is to the specified heat sink operating temperature.


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