The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7924494 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 12, 2011

Filed:

Dec. 04, 2009
Applicants:

Ming-hau Tung, San Francisco, CA (US);

Brian W. Arbuckle, Danville, CA (US);

Philip Don Floyd, Redwood City, CA (US);

William Cummings, Millbrae, CA (US);

Inventors:

Ming-Hau Tung, San Francisco, CA (US);

Brian W. Arbuckle, Danville, CA (US);

Philip Don Floyd, Redwood City, CA (US);

William Cummings, Millbrae, CA (US);

Assignee:

QUALCOMM MEMS Technologies, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 26/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.


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