The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2011

Filed:

Aug. 22, 2008
Applicants:

Ching-hung Liu, Taichung County, TW;

Chen-chung Liu, Hsinchu, TW;

Keng-hong Wang, Tainan County, TW;

Inventors:

Ching-Hung Liu, Taichung County, TW;

Chen-Chung Liu, Hsinchu, TW;

Keng-Hong Wang, Tainan County, TW;

Assignee:

Cyntec Co., Ltd., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/42 (2006.01); H01P 3/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A balun includes a first, second, and third metallic layers, a first dielectric layer disposed between the second and third metallic layers, and a dielectric substrate. The second metallic layer includes a first spiral line having sequentially connected first line segments and a second spiral line having sequentially connected second line segments. A first distance between each two opposite sides of a first region encircled by the innermost first line segments is greater than a second distance between each two adjacent parallel first line segments. A third distance between each two opposite sides of a second region encircled by the innermost second line segments is greater than a fourth distance between each two adjacent parallel second line segments. The third metallic layer includes a third and a fourth spiral lines. The first metallic layer and other elements as a whole are disposed on an opposite surface of the dielectric substrate.


Find Patent Forward Citations

Loading…