The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2011
Filed:
Dec. 11, 2006
Yuichi Furukawa, Oyama, JP;
Shinobu Yamauchi, Oyama, JP;
Nobuhiro Wakabayashi, Oyama, JP;
Shintaro Nakagawa, Oyama, JP;
Keiji Toh, Kariya, JP;
Eiji Kono, Kariya, JP;
Kota Otoshi, Kariya, JP;
Katsufumi Tanaka, Kariya, JP;
Yuichi Furukawa, Oyama, JP;
Shinobu Yamauchi, Oyama, JP;
Nobuhiro Wakabayashi, Oyama, JP;
Shintaro Nakagawa, Oyama, JP;
Keiji Toh, Kariya, JP;
Eiji Kono, Kariya, JP;
Kota Otoshi, Kariya, JP;
Katsufumi Tanaka, Kariya, JP;
Showa Denko K.K., Minato-ku, Tokyo, JP;
Kabushiki Kaisha Toyota Jidoshokki, Aichi-ken, JP;
Abstract
A semiconductor moduleincludes a ceramic substrate having a front surface on which a semiconductor elementis mounted and a rear surface on the opposite side of the front surface, a front metal platejoined to the front surface, a rear metal platejoined to the rear surface, and a heat sinkjoined to the rear metal plate. The rear metal plateincludes a joint surfacethat faces the heat sink. The joint surfaceincludes a joint area and a non-joint area. The non-joint area includes recesseswhich extend in the thickness direction of the rear metal plate. The joint area of the rear metal plateis in a range from 65% to 85% of the total area of the joint surfaceon the rear metal plate. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.