The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2011
Filed:
May. 06, 2008
Applicants:
Hsien-chyi Chiou, Hsinchu, TW;
Jui-ming Wei, Taichung, TW;
Inventors:
Hsien-Chyi Chiou, Hsinchu, TW;
Jui-Ming Wei, Taichung, TW;
Assignee:
Mediatek Inc., Science-Based Industrial Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multi-chip module (MCM) includes a first die and a second die. The first die supports a plurality of predetermined functions. The second die is coupled to the first die and comprises at least an option pad configured for a bonding option. The first die performs a predetermined function according to a bonding status of the option pad of the second die.