The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2011
Filed:
Jun. 06, 2006
Franz Dietz, Untereisesheim, DE;
Volker Dudek, Brackenheim, DE;
Tobias Florian, Stuttgart, DE;
Michael Graf, Leutenbach, DE;
Franz Dietz, Untereisesheim, DE;
Volker Dudek, Brackenheim, DE;
Tobias Florian, Stuttgart, DE;
Michael Graf, Leutenbach, DE;
TELEFUNKEN Semiconductors GmbH & Co. KG, Heilbronn, DE;
Abstract
A method for manufacturing a metal-semiconductor contact in semiconductor Components is disclosed. There is a relatively high risk of contamination in the course of metal depositions in prior-art methods. In the disclosed method, the actual metal -semiconductor or Schottky contact is produced only after the application of a protective layer system, as a result of which it is possible to use any metals, particularly platinum, without the risk of contamination.