The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2011
Filed:
Jul. 29, 2010
Takashi Kikuchi, Tokyo, JP;
Koichi Kanemoto, Tokyo, JP;
Chuichi Miyazaki, Tokyo, JP;
Toshihiro Shiotsuki, Tokyo, JP;
Takashi Kikuchi, Tokyo, JP;
Koichi Kanemoto, Tokyo, JP;
Chuichi Miyazaki, Tokyo, JP;
Toshihiro Shiotsuki, Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
In the semiconductor device which has the structure which stores a plurality of semiconductor chips with which plane sizes differ in the same sealing body in the state where they are accumulated via DAF, thickness of DAF of the back surface of the uppermost semiconductor chip with which the control circuit was formed was made thicker than each of DAF of the back surface of the lower layer semiconductor chip with which the memory circuit was formed. Hereby, the defect that the bonding wire which connects the uppermost semiconductor chip and a wiring substrate contacts the main surface corner part of a lower layer semiconductor chip can be reduced.