The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2011

Filed:

Sep. 13, 2006
Applicants:

Eisuke Suzuki, Tokyo, JP;

Akinori Takeda, Tokyo, JP;

Inventors:

Eisuke Suzuki, Tokyo, JP;

Akinori Takeda, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/00 (2006.01); B65B 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides: a multilayer film for top-seal to be used for a tray having a surface layer containing a polystyrene-based resin, the multilayer film at least having a first layer and a second layer, the first layer containing 50% by weight or more of at least one selected from the group consisting of (a) a copolymer including a conjugated diene and a vinyl aromatic compound; (b) a copolymer resulting from hydrogenation of a copolymer including a conjugated diene and a vinyl aromatic compound; (c) a combined resin of: a hydrogenated product of a copolymer including a conjugated diene and a vinyl aromatic compound; and an α-olefin copolymer; (d) a mixture of: a combined resin of: a hydrogenated product of a copolymer including a conjugated diene and a vinyl aromatic compound; and an α-olefin copolymer, and an ethylene-α-olefin copolymer, and (e) a mixture of: a combined resin of: a hydrogenated product of a copolymer including a conjugated diene and a vinyl aromatic compound; and an α-olefin copolymer, and a branched low-density polyethylene, the multilayer film having: a gel fraction of from 0.5 to 50% by weight; a thickness of 70 μM or less; a tensile modulus of from 40 to 300 MPa in any direction; and a thermal shrinkage ratio at 200° F. of from 15 to 75% in any direction; a packaged body using the multilayer film; and a process for producing the multilayer film.


Find Patent Forward Citations

Loading…