The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Dec. 03, 2008
Toru Noguchi, Ueda, JP;
Hiroyuki Ueki, Ueda, JP;
Akira Magario, Ueda, JP;
Shigeki Inukai, Ueda, JP;
Masaei Ito, Sagamihara, JP;
Takashi Wanibuchi, Kitamoto, JP;
Takushi Matsushita, Kounosu, JP;
Tsuyoshi Watanabe, Ina-machi, JP;
Toru Noguchi, Ueda, JP;
Hiroyuki Ueki, Ueda, JP;
Akira Magario, Ueda, JP;
Shigeki Inukai, Ueda, JP;
Masaei Ito, Sagamihara, JP;
Takashi Wanibuchi, Kitamoto, JP;
Takushi Matsushita, Kounosu, JP;
Tsuyoshi Watanabe, Ina-machi, JP;
Nissin Kogyo Co., Ltd., Ueda, JP;
Schlumberger Technology Corporation, Sugar Land, TX (US);
Abstract
A heat-resistant seal material includes 100 parts by weight of a ternary fluoroelastomer, 1 to 30 parts by weight of vapor-grown carbon fibers having an average diameter of more than 30 nm and 200 nm or less, and carbon black having an average particle diameter of 25 to 500 nm. The heat-resistant seal material contains the vapor-grown carbon fibers and the carbon black in an amount of 20 to 40 parts by weight in total. The heat-resistant seal material has a compression set when subjected to a compression set test at a compression rate of 25% and a temperature of 200° C. for 70 hours of 0 to 15% and a dynamic modulus of elasticity at 200° C. (E'/200° C.) of 30 to 100 MPa.