The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Jan. 31, 2008
Kazuhisa Maeda, Ibaraki, JP;
Isao Hirose, Ibaraki, JP;
Kunio Nagasaki, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The present invention relates to a process for producing a pressure-sensitive adhesive layer, which includes irradiating a photopolymerizable acrylic pressure-sensitive adhesive composition layer provided between two films with an active energy beam to polymerize the photopolymerizable acrylic pressure-sensitive adhesive composition layer, in which the polymerization is performed while a layer of a composition for preventing polymerization inhibition which is curable with an active energy beam in the atmosphere is provided on a side surface of the photopolymerizable acrylic pressure-sensitive adhesive composition layer. According to the process for producing a pressure-sensitive adhesive layer of the present invention, owing to the construction as discussed above, it is possible to reuse a film. Moreover, it is possible to prevent a lowering in the cohesive force in the side surface of the thus formed pressure-sensitive adhesive composition layer caused by a lowering in the polymerization degree in the side surface of the photopolymerizable acrylic pressure-sensitive adhesive composition layer during the photopolymerization.