The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Apr. 20, 2007
Toru Hirata, Yokosuka, JP;
Toru Hirata, Yokosuka, JP;
Sumitomo Heavy Industries, Ltd., Shinagawa-Ku, Tokyo, JP;
Abstract
Disclosed is a resin molding apparatus capable of enhancing transfer accuracy, reducing the cost of a molding apparatus, and shortening a molding cycle. The resin molding apparatus includes a first mold; a second mold disposed in opposition to the first mold; a transfer plate () attached to one of the first and second molds and comprising a transfer surface bearing a pattern of pits and projections and oriented toward a cavity (C, C); and a thermal insulation layer () disposed between the transfer plate () and the one of the first and second molds and formed through growth from the transfer plate () side or from the one of the first and second mold sides. Being disposed between the transfer plate () and the one of the first and second molds, the thermal insulation layer () can restrain dissipation of thermal energy of a molding material toward the mold. This can restrain formation of a skin layer, which would otherwise result from a sharp drop in temperature of the molding material, whereby transfer accuracy can be enhanced.