The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Apr. 18, 2005
Steven J. Charlebois, Goshen, IN (US);
Leslie N. Gilbertson, Warsaw, IN (US);
Michael E. Hawkins, Columbia City, IN (US);
Dana J. Medlin, Warsaw, IN (US);
H. Ravindranath Shetty, Warsaw, IN (US);
Steven A. Zawadzki, Leesburg, IN (US);
Steven J. Charlebois, Goshen, IN (US);
Leslie N. Gilbertson, Warsaw, IN (US);
Michael E. Hawkins, Columbia City, IN (US);
Dana J. Medlin, Warsaw, IN (US);
H. Ravindranath Shetty, Warsaw, IN (US);
Steven A. Zawadzki, Leesburg, IN (US);
Zimmer Technology, Inc., Warsaw, IN (US);
Abstract
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.