The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2011

Filed:

Mar. 14, 2008
Applicants:

Jin Tae Kim, Daejeon, KR;

Suntak Park, Daejeon, KR;

Jung Jin Ju, Daejeon, KR;

Seung Koo Park, Daejeon, KR;

Min-su Kim, Daejeon, KR;

Myung Hyun Lee, Daejeon, KR;

Inventors:

Jin Tae Kim, Daejeon, KR;

Suntak Park, Daejeon, KR;

Jung Jin Ju, Daejeon, KR;

Seung Koo Park, Daejeon, KR;

Min-Su Kim, Daejeon, KR;

Myung Hyun Lee, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are an opto-electric bus module and a method of manufacturing the opto-electric bus module. The opto-electric bus module includes an opto-electric interconnection unit where a concave-shaped micro structure is formed on a lower surface of a polymer structure and an optical bench where a convex-shaped micro structure is formed in a position corresponding to the concave-shaped micro structure, at least one second electric interconnection for electric connection with a semiconductor chip is formed, and the semiconductor chip and an opto-electric device can be mounted. Thus, automatic, efficient, high-speed, and high-integration optical communication and electric communication between multi-chips can be completed at the same time by using the opto-bus module which provides low-speed electric communication while manually maintaining solid optical coupling.


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