The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2011

Filed:

Apr. 08, 2008
Applicants:

Masateru Koide, Kawasaki, JP;

Tomoyuki Abe, Kawasaki, JP;

Inventors:

Masateru Koide, Kawasaki, JP;

Tomoyuki Abe, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01R 12/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to an aspect of an embodiment, a multilayer interconnection substrate includes a resin substrate layer including a first insulating layer made of a resin, and a first interconnection layer made of a conductive material, a ceramic substrate layer including a second insulating layer made of a ceramic, and a second interconnection layer made of a conductive material, a mechanically bonding layer mechanically bonding the resin substrate layer and the ceramic substrate layer which are laminated, and an electrically bonding member penetrating the mechanically bonding layer and electrically bonding the resin substrate layer and the ceramic substrate layer.


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