The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2011
Filed:
Dec. 01, 2005
Wai B. Fu, Menlo Park, CA (US);
Hieu Lam, Milpitas, CA (US);
Shahram Y. Mehdizadeh, Valley Village, CA (US);
Yeak-chong Wong, San Jose, CA (US);
Wai B. Fu, Menlo Park, CA (US);
Hieu Lam, Milpitas, CA (US);
Shahram Y. Mehdizadeh, Valley Village, CA (US);
Yeak-Chong Wong, San Jose, CA (US);
Hitachi Global Storage Technologies, Netherlands B.V., Amsterdam, NL;
Abstract
Embodiments of the present invention pertain to controlling thickness of wafers during electroplating process. Information pertaining to an old current used during an electroplating process of a previous wafer is received. Information pertaining to the thickness of the previous wafer is received. A new current is automatically determined. The new current is to be used during an electroplating process for a new wafer. The new current is determined based on the information pertaining to the old current and the information pertaining to the thickness of the previous wafer.