The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2011
Filed:
Oct. 26, 2005
Atsushi Naito, Aichi-ken, JP;
Kanji Sekihara, Aichi-ken, JP;
Yoshihiro Okumura, Aichi-ken, JP;
Akihiko Matsumoto, Aichi-ken, JP;
Atsushi Naito, Aichi-ken, JP;
Kanji Sekihara, Aichi-ken, JP;
Yoshihiro Okumura, Aichi-ken, JP;
Akihiko Matsumoto, Aichi-ken, JP;
Konica Minolta Opto, Inc., Tokyo, JP;
Abstract
A purpose is to provide an optical component molding apparatus for producing a small-size and high-precision optical component and achieving good transferability and stability of a molded product. A multi-cavity molding machinehas a gate, a runner, and a sprueeach having the shape determined to meet conditions (1) to (5): (1) 'Miminum gate thickness'/'Maximum runner thickness' is in a range of more than 0.2 to less than 1.0; (2) “Gate length”/“Maximum runner thickness” is in a range of more than 0.4 to less than 4.0; (3) “Outlet diameter of sprue” is in a range of more than 1.0 mm to less than 5.5 mm; (4) “Sprue length” is in a range of more than 10 mm to less than 40 mm; and (5) “Outlet diameter of sprue”/“Inlet diameter of sprue” is in a range of more than 1 to less than 8.