The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2011
Filed:
Oct. 26, 2006
Applicants:
Roger S. Kerr, Brockport, NY (US);
Timothy J. Tredwell, Fairport, NY (US);
Mark A. Harland, Hilton, NY (US);
Inventors:
Roger S. Kerr, Brockport, NY (US);
Timothy J. Tredwell, Fairport, NY (US);
Mark A. Harland, Hilton, NY (US);
Assignee:
Carestream Health, Inc., Rochester, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/36 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming an electronic device () on a metal substrate () deposits a first seed layer () of a first metal on at least one master surface () with a roughness less than 400 nm. A supporting metal layer () is bonded to the first seed layer () to form the metal substrate (). The metal substrate () is removed from the master surface (), and at least one electronic device () is formed on the seed layer () of the metal substrate ().