The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2011

Filed:

Aug. 25, 2009
Applicants:

Chia-hsi Tsai, Taipei, TW;

Cheng-te Tseng, Taipei, TW;

Tzu-kan Chen, Taipei, TW;

Meng-hsin Kuo, Taishan Township, Taipei County, TW;

Inventors:

Chia-Hsi Tsai, Taipei, TW;

Cheng-Te Tseng, Taipei, TW;

Tzu-Kan Chen, Taipei, TW;

Meng-Hsin Kuo, Taishan Township, Taipei County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 3/00 (2006.01); G02B 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250□; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.


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