The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Oct. 05, 2006
Robert Ingenbleek, Kressbronn a.B., DE;
Erik Jung, Falkensee, DE;
Alfred Kolb, Friedrichshafen, DE;
Andreas Rekofsky, Duggendorf/Hochdorf, DE;
Roland Schöllhorn, Friedrichshafen, DE;
Daniela Wolf, Regensburg, DE;
Robert Ingenbleek, Kressbronn a.B., DE;
Erik Jung, Falkensee, DE;
Alfred Kolb, Friedrichshafen, DE;
Andreas Rekofsky, Duggendorf/Hochdorf, DE;
Roland Schöllhorn, Friedrichshafen, DE;
Daniela Wolf, Regensburg, DE;
Continental Automotive GmbH, Munich, DE;
Abstract
An electronic circuit arrangement includes a heat sink and a first circuit carrier which is thermally coupled to the heat sink, lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component is arranged under a second circuit carrier which is held in a recess in the first circuit carrier. The recess passes through to the top side of the heat sink.