The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Jan. 22, 2009
Tomoyoshi Tada, Annaka, JP;
Shoichi Osada, Annaka, JP;
Miyuki Wakao, Annaka, JP;
Kazutoshi Tomiyoshi, Annaka, JP;
Kenichi Totsuka, Annaka, JP;
Tadaharu Ikeda, Annaka, JP;
Tomoyoshi Tada, Annaka, JP;
Shoichi Osada, Annaka, JP;
Miyuki Wakao, Annaka, JP;
Kazutoshi Tomiyoshi, Annaka, JP;
Kenichi Totsuka, Annaka, JP;
Tadaharu Ikeda, Annaka, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 μm, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components.