The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Oct. 16, 2008
Hirofumi Fujii, Ibaraki, JP;
Katsutoshi Hirashima, Ibaraki, JP;
Masaki Mizutani, Ibaraki, JP;
Kyouyuu JO, Ibaraki, JP;
Hirofumi Fujii, Ibaraki, JP;
Katsutoshi Hirashima, Ibaraki, JP;
Masaki Mizutani, Ibaraki, JP;
Kyouyuu Jo, Ibaraki, JP;
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Abstract
A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises: (A) a cyclic phosphazene compound represented by the following general formula (1): wherein at least one of the Rs is an organic group having the urethane(meth)acrylate structure represented by the following general formula (2) and n is a positive number of 2 to 5: wherein Ris a hydrogen atom or a methyl group;(B) a carboxyl-containing linear polymer obtained by polymerizing an ethylenically unsaturated compound through addition polymerization;(C) an epoxy resin;(D) an ethylenically unsaturated group-containing polymerizable compound; and(E) a photopolymerization initiator;wherein the cyclic phosphazene compound (A) is present in a proportion of 5 to 30 wt % based on the total weight of the composition.