The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2011

Filed:

Dec. 01, 2009
Applicant:

Katsuji Yoshida, Tokyo, JP;

Inventor:

Katsuji Yoshida, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a semiconductor device, forms connection pads electrically connected to integrated circuit portion formed in a semiconductor substrate, lays an insulating film and a protective film one over another, forms sub-lines electrically connected to the connection pads on the protective film, forms a coating film covering the sub-lines and the protective film, sticks a dry film onto the coating film, forms external connection electrodes externally connectable and electrically connected to the sub-lines, and removes the dry film and forms a sealing layer covering the coating film and side surfaces of the external connection electrodes.


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