The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
May. 22, 2008
Masayuki Uchida, Yokohama, JP;
Hisashi Ito, Fujisawa, JP;
Kazuhito Higuchi, Yokohama, JP;
Takashi Togasaki, Yokohama, JP;
Masayuki Uchida, Yokohama, JP;
Hisashi Ito, Fujisawa, JP;
Kazuhito Higuchi, Yokohama, JP;
Takashi Togasaki, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
For a suppressed breakage after a flip chip connection of a semiconductor device using a low-permittivity insulation film and a lead-free solder together, with an enhanced production yield, bump electrodes () are heated by a temperature profile having, after a heating up to a melting point of the bump electrodes () or more, a cooling in which a temperature within a range of 190 to 210° C. is kept for an interval of time within a range of 3 to 15 minutes, and a condition is met, such that 1.4<L/L<1.6, where Lis a diameter of second electrode pads (), and Lis a diameter of first electrode pads ().