The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2011

Filed:

Nov. 12, 2003
Applicants:

Nobuo Kimura, Ichihara, JP;

Yoshitaka Fujita, Ichihara, JP;

Norifumi Nakamoto, Ichihara, JP;

Motoyuki Toki, Kyoto, JP;

Akiji Higuchi, Kyoto, JP;

Kazuo Ono, Ichihara, JP;

Tomoya Hidaka, Ichihara, JP;

Hiroyuki Takeda, Ichihara, JP;

Inventors:

Nobuo Kimura, Ichihara, JP;

Yoshitaka Fujita, Ichihara, JP;

Norifumi Nakamoto, Ichihara, JP;

Motoyuki Toki, Kyoto, JP;

Akiji Higuchi, Kyoto, JP;

Kazuo Ono, Ichihara, JP;

Tomoya Hidaka, Ichihara, JP;

Hiroyuki Takeda, Ichihara, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C01G 23/047 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides dispersoids having metal-oxygen groups which are suitable for the production of metal oxide thin-films at a low temperature of 200° C. or below and for the production of homogeneous organic-inorganic hybrid materials. The invention also provides metal oxide thin-films and organic-inorganic hybrid materials endowed with various capabilities, particularly organic-inorganic hybrid materials having a high refractive index and high transparency. Use is made of a dispersoid having metal-oxygen bonds which is obtained by mixing a metal compound having at least three hydrolyzable groups with at least 0.5 mole but less than 2 moles of water per mole of the metal compound in an organic solvent, in the absence of an acid, a base and/or a dispersion stabilizer, and at a temperature at or below the temperature at which the metal compound begins to hydrolyze, then raising the temperature to at least the temperature at which hydrolysis begins.


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