The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Jan. 24, 2008
Chien-kuo Liu, Miaoli, TW;
Tung-yuan Yung, Bade, TW;
Kin-fu Lin, Taipei, TW;
Szu-han Wu, Taoyuan, TW;
Chien-Kuo Liu, Miaoli, TW;
Tung-Yuan Yung, Bade, TW;
Kin-Fu Lin, Taipei, TW;
Szu-Han Wu, Taoyuan, TW;
Atomic Energy Council-Institute of Nuclear Energy Research, Taoyuan County, TW;
Abstract
Three bonding materials are provided on a first plate. The first bonding material is located between the second and third bonding materials. The first bonding material is thicker than the other bonding materials. A second plate is provided on the first bonding material. All of the plates and the bonding materials are heated to the softening point of the first bonding material. A load is exerted on the first bonding material to reduce the thickness of the first bonding material to that of the second and third bonding materials and transfer the load to the second and third bonding materials from the first bonding material. The temperature is raised to and kept at the crystallization point of the first bonding material. The temperature is raised to the wetting point of the second and third bonding materials.